The global liquid encapsulation materials market is expected to expand due to the increasing demand for advanced packaging techniques, consumer electronics Types, and the growing trend of miniaturization of electronics types. During the final stage of the semiconductor manufacturing process, advanced packaging protects silicon wafers, logic modules, and memory from physical damage and corrosion.
Different integrated circuits (ICs) have different packaging specifications, which means advanced packaging will outperform conventional packaging. Furthermore, advanced packaging is projected to have greater capabilities than traditional packaging, creating lucrative prospects for advanced packaging industry developments in the coming years.
Consumer electronics types demand smartphones and devices, as well as the Internet of Things (IoT), advanced packaging suppliers are developing several processes and methods to reduce overall costs and increase operational performance.